Wafer-Level Chip-Scale Packaging: Analog and Power by Shichun Qu,Yong Liu

By Shichun Qu,Yong Liu

Analog and tool Wafer point Chip Scale Packaging provides a state-of-art and in-depth evaluation in analog and gear WLCSP layout, fabric characterization, reliability and modeling. fresh advances in analog and tool digital WLCSP packaging are awarded according to the improvement of analog expertise and tool machine integration. The ebook covers intimately how advances in semiconductor content material, analog and gear complicated WLCSP layout, meeting, fabrics and reliability have co-enabled major advances in fan-in and fan-out with redistributed layer (RDL) of analog and tool machine potential in the course of fresh years. because the analog and gear digital wafer point packaging isn't the same as average electronic and reminiscence IC package deal, this publication will systematically introduce the common analog and tool digital wafer point packaging layout, meeting approach, fabrics, reliability and failure research, and fabric choice. besides new analog and tool WLCSP improvement, the position of modeling is a key to guarantee profitable package deal layout. an outline of the analog and gear WLCSP modeling and normal thermal, electric and tension modeling methodologies can also be awarded within the book.

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